Heat conductive resin composition

专利名称：Heat conductive resin composition发明人：清水 隆浩,神谷 元暢申请号：JP2018516861申请日：20180326

公开号：JPWO2018181146A1公开日：20200206

摘要：LiquidityToughnessHeat conductive resin composition excellent in heatconductivityThe heat conductive resin composition isThermoplastic polyester

resinThermoplastic polyester elastomer (b)And comprises a thermally conductive resincomposition containing graphite (c);Each contains 30 to 55 mass parts(b) 5 to 20 massparts(c) is 25 to 60 mass parts ((a) + (b) + (c) = 100 parts by mass)AndThe thermalconductivity of the molded article obtained from the heat conductive resin composition is5 W / (m.k.k.) or higherWidth 10 mmFlow length in the shape of 2 mm thickness

(measurement condition: cylinder temperature of 280 ℃)Mold temperatureThe pressureof 60 MPa is 200 mm or more.

申请人：東洋紡株式会社

地址：大阪府大阪市北区堂島浜二丁目２番８号

国籍：JP

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