Probe card

申请(专利)号： US201815984420

专利号： US10184956B2 主分类号： G01R1/073

申请权利人： VIA

TECHNOLOGIES, INC. 公开国代码： US 优先权国家： TW

摘 要：

A probe card including a circuit board, a transformer, a probe head, and a

reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is

located between the circuit board and the second surface. The solder balls are

disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit

申请日： 2018-05-21 公开公告日： 2019-01-22

分类号： G01R1/073;

G01R1/20; G01R31/02; G01R31/26; G01R31/28; H01L21/66; H01L21/84; H01R12/06 发明设计人： CHEN-YUEH KUNG;

WEN-YUAN CHANG;

WEI-CHENG CHEN 申请国代码： US

优先权： 20131104 TW

102139998 A

摘 要 附 图：

board. 主权项：

权 利 要 求 说 明 书

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说 明 书

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