MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INC

专利名称：MICROELECTRONIC DIE PACKAGES WITH

METAL LEADS, INCLUDING METAL LEADSFOR STACKED DIE PACKAGES, ANDASSOCIATED SYSTEMS AND METHODS

发明人：Eng Meow Koon,Chia Yong Poo,Boon Suan

Jeung

申请号：US134925申请日：20120608

公开号：US20120241957A1公开日：20120927

专利附图：

摘要：Microelectronic die packages, stacked systems of die packages, and methods ofmanufacturing them are disclosed herein. In one embodiment, a system of stackedpackages includes a first die package having a bottom side, a first dielectric casing, andfirst metal leads; a second die package having a top side attached to the bottom side ofthe first package, a dielectric casing with a lateral side, and second metal leads alignedwith and projecting towards the first metal leads and including an exterior surface and aninterior surface region that generally faces the lateral side; and metal solder connectorscoupling individual first leads to individual second leads. In a further embodiment, theindividual second leads have an “L” shape and physically contact correspondingindividual first leads. In another embodiment, the individual second leads have a “C”shape and include a tiered portion that projects towards the lateral side of the secondcasing.

申请人：Eng Meow Koon,Chia Yong Poo,Boon Suan Jeung

地址：Singapore SG,Singapore SG,Singapore SG

国籍：SG,SG,SG

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