Flip-chip packaged SMD-type LED with antistatic fu

专利名称：Flip-chip packaged SMD-type LED with

antistatic function and having no wirebonding

发明人：Mu-Jen Lai申请号：US10982767申请日：20041108

公开号：US20060012053A1公开日：20060119

专利附图：

摘要：A flip-chip packaged SMD-type (surface-mount device) light emitting diode isprovided. The light emitting diode chip is packaged in flip chip packages and is connected

with an electrostatic protection device such as a transient voltage suppressor (TVS) or aZener diode. The electrostatic protection device is attached with a substrate so as toform a flip-chip packaged SMD-type light emitting diode. The light emitting diode chip isconnected to a lead frame of the substrate by a high electrical and heat conductivecomponent thus the device needs no wire bonding. Due to the electrostatic protectiondevice, the device has static control effect.

申请人：Mu-Jen Lai

地址：Chungli City TW

国籍：TW

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