MMBT3904LP 40V NPN SURFACE MOUNT TRANSISTOR
Features
• • • • •
Complementary PNP Type Available (MMBT3906LP) Ultra-Small Leadless Surface Mount Package “Lead Free”, RoHS Compliant (Note 1)
Halogen and Antimony Free \"Green\" Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: X1-DFN1006-3 • Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Finish ⎯ NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208 • Weight: 0.0008 grams (approximate)
CX1-DFN1006-3
BBCETop View Device Schematic
EBottom View
Device Symbol
Ordering Information (Note 3)
Product MMBT3904LP-7 MMBT3904LP-7B
Notes:
Marking Reel size (inches) Tape width (mm) Quantity per reel 1N 7 8mm 3,000 1N 7 8mm 10,000 1. No purposefully added lead.
2. Diodes Inc's \"Green\" policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
MMBT3904LP-7 MMBT3904LP-7B
1NTop View Dot Denotes Collector Side
1NTop View Bar Denotes Base and Emitter Side
1N = Product Type Marking Code
MMBT3904LP
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Document number: DS31835 Rev. 4 - 2
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MMBT3904LPMaximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit 60 V Collector-Base Voltage VCBO
40 V Collector-Emitter Voltage VCEO
6.0 V Emitter-Base Voltage VEBO
200 mA Collector Current - Continuous (Note 4) IC
Thermal Characteristics
Characteristic Symbol Value Unit 250 mW Power Dissipation (Note 4) PD
Thermal Resistance, Junction to Ambient (Note 4) 500 °C/W RθJA
-55 to +150 Operating and Storage and Temperature Range °C TJ, TSTG
Notes:
4. Device mounted on FR-4 PCB pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com
1r(t), TRANSIENT THERMAL RESISTANCED = 0.9D = 0.7D = 0.50.1D = 0.3D = 0.1D = 0.05RθJA(t) = r(t) * RθJARθJA = 500°C/WP(pk)0.01D = 0.02D = 0.01D = 0.005D = Single Pulset1t2TJ - TA = P * RθJA(t)Duty Cycle, D = t1/t20.0011E-060.000010.00010.0010.010.1110t1, PULSE DURATION TIME (s)Fig. 1 Transient Thermal Response0.41001,00010,0001,000P(pk), PEAK TRANSIENT POWER (W)Single Pulse100RθJA(t) = r(t) * RθJARθJA = 500°C/WTJ - TA = P * RθJA(t)PD, POWER DISSIPATION (W)0.3Note 4100.210.10.11E-060.00010.01110010,000t1, PULSE DURATION TIME (s)Fig. 2 Single Pulse Maximum Power Dissipation0020406080100120140160TA, AMBIENT TEMPERATURE (°C)Fig. 3 Power Dissipation vs. Ambient Temperature
MMBT3904LP
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Document number: DS31835 Rev. 4 - 2
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MMBT3904LPElectrical Characteristics @TA = 25°C unless otherwise specified
Characteristic SymbolOFF CHARACTERISTICS
Collector-Base Breakdown Voltage BVCBO Collector-Emitter Breakdown Voltage (Note 5) BVCEO Emitter-Base Breakdown Voltage BVEBO Collector Cutoff Current ICEX Base Cutoff Current IBL ON CHARACTERISTICS (Note 5)
60 40 6.0 ⎯ ⎯ 40 70 100 60 30 ⎯ 0.65 ⎯
V ⎯ IC = 10μA, IE = 0 V ⎯ IC = 1.0mA, IB = 0 V ⎯ IE = 10μA, IC = 0
50 nA VCE = 30V, VEB(OFF) = 3.0V 50 nA VCE = 30V, VEB(OFF) = 3.0V ⎯ ⎯ 300 ⎯ ⎯ 0.20 0.30 0.85 0.95
IC = 100µA, VCE = 1.0V IC = 1.0mA, VCE = 1.0V IC = 10mA, VCE = 1.0V IC = 50mA, VCE = 1.0V IC = 100mA, VCE = 1.0V IC = 10mA, IB = 1.0mA IC = 50mA, IB = 5.0mA IC = 10mA, IB = 1.0mA IC = 50mA, IB = 5.0mA
Min Max Unit Test Condition DC Current Gain hFE
⎯
Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Output Capacitance Input Capacitance Input Impedance
Voltage Feedback Ratio Small Signal Current Gain Output Admittance
Current Gain-Bandwidth Product SWITCHING CHARACTERISTICS Delay Time Rise Time Storage Time Fall Time
Notes:
5. Short duration pulse test used to minimize self-heating effect.
VCE(sat) VBE(sat) Cobo Cibo hie hre hfe hoe fT td tr ts tf
V V
4.0 pF ⎯ VCB = 5.0V, f = 1.0MHz, IE = 0 8.5 pF ⎯ VEB = 0.5V, f = 1.0MHz, IC = 0
1.0 10 kΩ
-40.5 8.0 x 10 VCE = 10V, IC = 1.0mA,
f = 1.0kHz 100 400 ⎯
1.0 40 μS
VCE = 20V, IC = 10mA,
300 MHz ⎯
f = 100MHz ⎯ ⎯ ⎯ ⎯
35 ns VCC = 3.0V, IC = 10mA, 35 ns VBE(off) = - 0.5V, IB1 = 1.0mA 200 ns VCC = 3.0V, IC = 10mA, 50 ns IB1 = IB2 = 1.0mA
0.140.12IC, COLLECTOR CURRENT (A)0.100.080.060.04IB = 0.2mA400350IB = 2mAVCE =1VTA = 150°CTA = 125°CTA = 85°CIB = 1.2mAIB = 0.8mAIB = 0.6mAIB = 0.4mAhFE ,DC CURRENT GAIN IB = 1.6mA30025020015010050TA = 25°CTA = -55°C0.020012345VCE, COLLECTOR-EMITTER VOLTAGE (V)Fig. 4 Typical Collector Current vs. Collector-Emitter Voltage0110100IC, COLLECTOR CURRENT (mA)Fig. 5 Typical DC Current Gain vs. Collector Current
MMBT3904LP
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Document number: DS31835 Rev. 4 - 2
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IC/IB = 20IC/IB = 10MMBT3904LP1VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V)VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V)0.1TA = 150°CTA = 125°CTA = 150°CTA = 125°C0.1TA = 85°CTA = -55°CTA = 25°CTA = 85°CTA = 25°CTA = -55°C0.010.1110100IC, COLLECTOR CURRENT (mA)Fig. 6 Typical Collector-Emitter Saturation Voltagevs. Collector CurrentVBE(SAT), BASE-EMITTER SATURATION VOLTAGE (V)0.010.1110100IC, COLLECTOR CURRENT (mA)Fig. 7 Typical Collector-Emitter Saturation Voltagevs. Collector CurrentVBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V)1.11.00.90.80.70.60.50.40.31TA = 25°CTA = -55°CTA = 125°CTA = 150°CVCE =5V1.11.00.90.80.7TA = 125°CTA = 150°CGain = 100.60.50.40.31TA = 85°CTA = 25°CTA = -55°CTA = 85°C10100IC, COLLECTOR CURRENT (mA)Fig. 8 Typical Base-Emitter Turn-On Voltage vs. Collector Current
10100IC, COLLECTOR CURRENT (mA)Fig. 9 Typical Base-Emitter Saturation Voltagevs. Collector Current
Package Outline Dimensions
AA1Db1Eb2eX1-DFN1006-3 DimMin Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b1 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.35 ⎯ ⎯ L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 0.40 ⎯ ⎯
All Dimensions in mm
L2L3L1MMBT3904LP
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Document number: DS31835 Rev. 4 - 2
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MMBT3904LPSuggested Pad Layout
CX1XG2YZG1Dimensions
Z G1 G2 X X1 Y C Value (in mm)
1.1 0.3 0.2 0.7 0.25 0.4 0.7
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
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Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
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MMBT3904LP
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Document number: DS31835 Rev. 4 - 2
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October 2011
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MMBT3904LP-7B
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