Polishing compositions and methods for polishing c

专利名称：Polishing compositions and methods for

polishing cobalt films

发明人：Luling Wang,Abhudaya Mishra,Deepak

Mahulikar,Richard Wen

申请号：US14857325申请日：20150917公开号：US09735031B2公开日：20170815

专利附图：

摘要：The present disclosure relates to polishing compositions that can polish Cobalt(Co) films in semiconductor substrates containing a multitude of films including Co,

metals, metal oxides and dielectrics. These polishing compositions comprise an abrasive,a weak acid acting as a removal rate enhancer (RRE), a pH adjuster, and an azole-containing corrosion inhibitor (CI). The RRE, pH adjuster and CI have a pKa in the 1-18range (1 (pKa)

申请人：Fujifilm Planar Solutions, LLC

地址：North Kingstown RI US

国籍：US

代理机构：Ohlandt, Greeley, Ruggiero & Perle, LLP

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